Solder Balls Solder Balls Solder Balls with Thermosetting Plastic
Cores
 |
Ball Grid Array
Thermosetting plastic is used as
photoresist for semiconductors. This plastic is further processed to include the
characteristics required for BGA-CSP balls. These new solder balls consist of
cores made of this plastic and the layers of copper and solder coated with
sub-micron accuracy.
|
Characteristics
We have developed core plastic balls
with micron accuracy,
which have high durability against compressive
force,
keeping the intrinsic properties of thermosetting plastics,
such
as heat-resistance, cold-resistance and chemical resistance.
Degree of True Sphericity over 99%
Accuracy ±1%
Available size: 300μ~800
μm
Please contact us if you require a
size less than 300μ m.
Various solder materials for solder
layers
including lead-free solder materials are available
according to
your needs.
Solder layers whose main constituents such as
Ag-Cu, Sn- Zn or
Sn-In, or Cu layers can be designed
according to your needs.
Heat resistance test at
270°C
The balls’ dimensional change caused
by solder reflow or repeated
exposure to heat and cold in ICs is small and
generation of cracks is suppressed.
They have a long life under thermal
expansion, water absorption and cold temperature.
It does not plastically deform under static or
dynamic loads because plastics possesses elasticity.
Comparison with 300μm balls
with plain copper cores.
Low defect rate by inspecting all
products.
We design products according to your
specifications.
Please tell us your specifications.
Core Size
Cu layer
thickness
Solder layer thickness, composition
Tolerance for finished size
of solder balls
If you wish to order a catalogue, please send us an
e-mail.
Copyright 2007 Little Device
Corporation
