Little Device Corporation was established to satisfy needs in the micromachining
technology field and to make advancements in the electronics industry.
The company has been developing and producing solder balls with
chemical processes and electronic or mechanical parts with coating technology.
The company’s name derives from dealing in little devices.


　←Data for a compression test is available.

　←Foreign country agency recruitment

There are various problems with many solder balls,
which are necessary for CSP/BGA, because the balls are
new to the market.
Our “solder balls with thermosetting plastic cores” have been developed
to overcome such problems.
Our plastic balls are excellent in physical properties such as compressive strength,
shape stability, durability under repeated exposure to heat and cold and aging deterioration,
compared to other products available in the market.