July, 2005 started to develop BGA semiconductor bumps
using solder balls with thermosetting plastic cores.
December, 2005 developed the
foundations of BGA semiconductor bumps.
November, 2006 completed the
reliability test.
November, 2006 applied for a
patent.
January, 2007 was rated
highly by the Japanese government.
April 16, 2007 was established
with the investment from related enterprises.
July 9. 2007 English Page Open
