July, 2005       started to develop BGA semiconductor bumps using solder balls with thermosetting plastic cores.

December, 2005      developed the foundations of BGA semiconductor bumps.
November, 2006      completed the reliability test.
November, 2006      applied for a patent.

January, 2007       was rated highly by the Japanese government.
April 16, 2007      was established with the investment from related enterprises.

July 9. 2007 English Page Open

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